Thermal cycle reliability of Cu-nanoparticle joint
نویسندگان
چکیده
Article history: Received 25 May 2015 Received in revised form 20 July 2015 Accepted 20 July 2015 Available online xxxx
منابع مشابه
Reliability of Cu nanoparticle joint for high temperature power electronics
Power cycle reliability of Cu nanoparticle joint has been studied for high temperature operation of power devices. Al2O3 heater chips and Cu–65 wt% Mo baseplates were joined by Cu nanoparticles and Sn–0.7Cu and power cycle tests of 65/200 C and 65/250 C were carried out on the joints. The Cu nanoparticles were prepared by reducing Cu carbonate in ethylene glycol with dodecanoic acid + dodecyl a...
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ورودعنوان ژورنال:
- Microelectronics Reliability
دوره 55 شماره
صفحات -
تاریخ انتشار 2015